Claims (1)
Claim 1 (Independent)
The ornamental design for a semiconductor module, as shown and described.
Full Description
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FIG. 1 is a front view of a semiconductor module showing our new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a perspective view thereof; and,
FIG. 8 is another perspective view thereof.
The broken lines illustrate portions of the article that form no part of the claimed design.
Citations
This patent cites (30)
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