Claims (1)
Claim 1 (Independent)
The ornamental design for a power semiconductor module as shown and described.
Full Description
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FIG. 1 is a perspective view of a power semiconductor module;
FIG. 2 is a front elevation view of the power semiconductor module;
FIG. 3 is a rear elevation view of the power semiconductor module;
FIG. 4 is a left side elevation view of the power semiconductor module;
FIG. 5 is a right side elevation view of the power semiconductor module;
FIG. 6 is a top plan view of the power semiconductor module; and,
FIG. 7 is a bottom plan view of the power semiconductor module.
Citations
This patent cites (15)
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