21 Patents
- US125917272026Lane Repair and Lane Reversal Implementation for Die-to-die (D2D) Interconnects
Intel Corporation
0 cites - US125050652025On-package Die-to-die (D2D) Interconnect for Memory Using Universal Chiplet Interconnect Express (ucie) PHY
Intel Corporation
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- US124059122025Link Initialization Training and Bring Up for Die-to-die Interconnect
Intel Corporation
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- US123725742025Skew Detection and Compensation for High Speed I/O Links0 cites
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- US122839942025Apparatus, Method, and System for Performing Error Correction Based on Laser Power Setting
Intel Corporation
0 cites - US121968072025Near Field Wireless Communication System for Mother to Package and Package to Package Sideband Digital Communication
Intel Corporation
0 cites - US121554742024Characterizing and Margining Multi-voltage Signal Encoding for Interconnects
Intel Corporation
0 cites - US121179602024Approximate Data Bus Inversion Technique for Latency Sensitive Applications
Intel Corporation
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