Patents/Inventors

Ziyin Lin

Chandler, AZUS6 patents

7 Patents

US121304822024
Hydrophobic Feature to Control Adhesive Flow
Intel Corporation
0 cites
US120682222024
Dummy Die Structures of a Packaged Integrated Circuit Device
Intel Corporation
0 cites
US120027272024
Barrier Structures for Underfill Containment
Intel Corporation
0 cites
US117768212023
Micro-electronic Package with Substrate Protrusion to Facilitate Dispense of Underfill Between a Narrow Die-to-die Gap
Intel Corporation
0 cites
US117495852023
High Thermal Conductivity, High Modulus Structure Within a Mold Material Layer of an Integrated Circuit Package
Intel Corporation
0 cites
US116886342023
Trenches in Wafer Level Packages for Improvements in Warpage Reliability and Thermals
Intel Corporation
0 cites
US116768762023
Semiconductor Die Package with Warpage Management and Process for Forming Such
Intel Corporation
0 cites