3 Patents
- US121129562024Chip Interconnection Package Structure and Method
Institute Of Semiconductors, Guangdong Academy Of Sciences
0 cites - US118698722024Chip Stack Packaging Structure and Chip Stack Packaging Method
Institute Of Semiconductors, Guangdong Academy Of Sciences
0 cites - US116096722023Touch Control Substrate and Preparation Method Thereof, Touch Control Module and Display Device
Institute Of Semiconductors, Guangdong Academy Of Sciences
0 cites