Patents/Inventors

Zi-xian Zhan

New TaipeiTW1 patent

2 Patents

US119730522024
Stud Bump for Wirebonding High Voltage Isolation Barrier Connection
TEXAS INSTRUMENTS INCORPORATED
0 cites
US118482972023
Semiconductor Device Packages with High Angle Wire Bonding and Non-gold Bond Wires
Texas Instruments Incorporated
0 cites