2 Patents
- US122437732025Liner and Barrier Layer in Dual Damascene Cu Interconnect for Enhanced EM and Process
Sien (Qingdao) Integrated Circuits Co., Ltd.
0 cites - US118347542023ALD Method with Multi-chambers for Sic or Multi-elements Epitaxial Growth
Sien (Qingdao) Integrated Circuits Co., Ltd.
0 cites