4 Patents
- US125327442026Packaging Module Including Electromagnetic Shielding Structure Having Conductive Pillars and Conductive Adhesive, and Packaging Method Therefor
HUAWEI TECHNOLOGIES CO., Ltd.
0 cites - 0 cites
- US124474322025Switchable Two-stage Coalescence Separation System
China University Of Petroleum-beijing
0 cites - US121548602024Method of Forming a Semiconductor Device Including Vertical Contact Fingers
Sandisk Technologies, Inc.
0 cites