Zhonghua Qian

5 Patents

• US125060152025

  Semiconductor Wafer Thinned by Horizontal Stealth Lasing

  Sandisk Technologies, Inc.

  0 cites
• US125060362025

  Dicing and Wafer Thinning to Form Semiconductor Dies

  Sandisk Technologies, Inc.

  0 cites
• US119013272024

  Wire Bonding for Semiconductor Devices

  WESTERN DIGITAL TECHNOLOGIES, Inc.

  0 cites
• US118943432024

  Vertical Semiconductor Device with Side Grooves

  Western Digital Technologies, Inc.

  0 cites
• US117569322023

  Sloped Interconnector for Stacked Die Package

  SANDISK TECHNOLOGIES LLC

  0 cites