Patents/Inventors

Zhiwei Gong

Chandler, AZUS23 patents

16 Patents

US126222802026
Semiconductor Device with Through Package via and Method Therefor
NXP USA, Inc.
0 cites
US125885572026
Multichip Packages with 3D Integration
NXP USA, Inc.
0 cites
US125572212026
Molded Packages with Through-mold Interconnects
NXP USA, Inc.
0 cites
US125388442026
Double-sided Multichip Packages
NXP USA, Inc.
0 cites
US124068962025
Semiconductor Device Package Having Thermal Dissipation Feature and Method Therefor
NXP USA, Inc.
0 cites
US123879852025
Semiconductor Device with Cavity Carrier and Method Therefor
NXP B.V.
0 cites
US121842372024
Surface-mount Amplifier Devices
NXP USA, Inc.
0 cites
US121257162024
Semiconductor Device Packaging Warpage Control
NXP USA, Inc.
0 cites
US120402912024
Radio Frequency Packages Containing Multilevel Power Substrates and Associated Fabrication Methods
NXP USA, Inc.
0 cites
US119675072024
Tie Bar Removal for Semiconductor Device Packaging
NXP USA, Inc.
0 cites
US119358092024
Semiconductor Package Thermal Spreader Having Integrated EF/EMI Shielding and Antenna Elements
NXP USA, Inc.
0 cites
US118474692023
Intelligent Device and Method for Controlling Boot Screen of the Intelligent Device
AMLOGIC (SHANGHAI) CO., Ltd.
0 cites
US118173662023
Semiconductor Device Package Having Thermal Dissipation Feature and Method Therefor
NXP USA, Inc.
0 cites
US117912832023
Semiconductor Device Packaging Warpage Control
NXP USA, Inc.
0 cites
US117282852023
Semiconductor Device Packaging Warpage Control
NXP USA, Inc.
0 cites
US115575252023
Semiconductor Package Thermal Spreader Having Integrated RF/EMI Shielding and Antenna Elements
NXP USA, Inc.
0 cites