Zhitao Chen

9 Patents

• US125754322026

  Chip Fine Line Fan-out Package Structure and Manufacturing Method Therefor

  Shenzhen Xiuyuan Electronic Technology Co., Ltd.

  0 cites
• US125062522025

  Fan-out Package Structure and Fabrication Method Therefor

  Institute Of Semiconductors, Guangdong Academy Of Sciences

  0 cites
• US122759182025

  Cleaning Compositions for Cleaning Hard Surfaces

  SHANGHAI JAHWA UNITED CO., Ltd.

  0 cites
• US122666232025

  Substrate Bonding Method

  Shenzhen Xiuyuan Electronic Technology Co., Ltd.

  0 cites
• US121842532024

  Filter Radio Frequency Module Packaging Structure and Method for Manufacturing Same

  Institute Of Semiconductors, Guangdong Academy Of Sciences

  0 cites
• US121129562024

  Chip Interconnection Package Structure and Method

  Institute Of Semiconductors, Guangdong Academy Of Sciences

  0 cites
• US118698722024

  Chip Stack Packaging Structure and Chip Stack Packaging Method

  Institute Of Semiconductors, Guangdong Academy Of Sciences

  0 cites
• US117846252023

  Packaging Method and Package Structure for Filter Chip

  GUANGDONG INSTITUTE OF SEMICONDUCTOR INDUSTRIAL TECHNOLOGY

  0 cites
• US116096722023

  Touch Control Substrate and Preparation Method Thereof, Touch Control Module and Display Device

  Institute Of Semiconductors, Guangdong Academy Of Sciences

  0 cites