Patents/Inventors

Zhitao Cao

Campbell, CAUS2 patents

3 Patents

US121598352024
High Density 3D Interconnect Configuration
Apple Inc.
0 cites
US121193042024
Very Fine Pitch and Wiring Density Organic Side by Side Chiplet Integration
Apple Inc.
0 cites
US117355262023
High Density 3D Interconnect Configuration
Apple Inc.
0 cites