Patents/Inventors

Zhimin Wan

Chandler, AZUS24 patents

18 Patents

US126178232026
Broad-spectrum Peptide Antigen of the Novel Coronavirus SARS-COV-2, Specific Neutralizing Antibody and Use Thereof
Yangzhou University
0 cites
US123082992025
Tec-embedded Dummy Die to Cool the Bottom Die Edge Hotspot
Intel Corporation
0 cites
US122665892025
Enhanced Base Die Heat Path Using Through-silicon Vias
Intel Corporation
0 cites
US122057932025
Method and Apparatus for Anisotropic Pattern Etching and Treatment
Lam Research Corporation
0 cites
US121912202025
Hybrid Interposer of Glass and Silicon to Reduce Thermal Crosstalk
Intel Corporation
0 cites
US121701822024
Ribbon Beam Angle Adjustment in an Ion Implantation System
Advanced Ion Beam Technology, Inc.
0 cites
US120948002024
Thermally Conductive Slugs/active Dies to Improve Cooling of Stacked Bottom Dies
Intel Corporation
0 cites
US120573692024
Enhanced Base Die Heat Path Using Through-silicon Vias
Intel Corporation
0 cites
US120465362024
Integrated Heat Spreader with Enhanced Vapor Chamber for Multichip Packages
Intel Corporation
0 cites
US119012622024
Cooling Solution Including Microchannel Arrays and Methods of Forming the Same
Intel Corporation
0 cites
US118942822024
Vented Lids for Integrated Circuit Packages
Intel Corporation
0 cites
US118549352023
Enhanced Base Die Heat Path Using Through-silicon Vias
Intel Corporation
0 cites
US118549312023
Stim/liquid Metal Filled Laser Drill Trench to Improve Cooling of Stacked Bottom Die
Intel Corporation
0 cites
US118375192023
Heatsink Cutout and Insulating Through Silicon Vias to Cut Thermal Cross-talk
Intel Corporation
0 cites
US116705612023
3D Buildup of Thermally Conductive Layers to Resolve Die Height Differences
Intel Corporation
0 cites
US116462442023
Socket Loading Mechanism for Passive or Active Socket and Package Cooling
Intel Corporation
0 cites
US116263952023
Thermal Spreading Management of 3D Stacked Integrated Circuits
Intel Corporation
0 cites
US115816712023
Integrated Circuit Package Socket Housing to Enhance Package Cooling
Intel Corporation
0 cites