11 Patents
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- US123694322025LED Epitaxial Structure and Preparation Method and Application Thereof
FOCUS LIGHTINGS TECH CO., Ltd.
0 cites - US121980972025Systems and Methods for Simulation of Package Configurations for Generating Cost Optimized Configurations
COUPANG Corp.
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- US119903952024Joint Connection of Corner Non-critical to Function (NCTF) Ball for BGA Solder Joint Reliability (SJR) Enhancement
Intel Corporation
0 cites - US118943442024Power Enhanced Stacked Chip Scale Package Solution with Integrated Die Attach Film
Intel Corporation
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- US117422842023Interconnect Structure Fabricated Using Lithographic and Deposition Processes
Intel Corporation
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- US116991282023Systems and Methods for Computer-determined Efficient Packaging Determination
Coupang Corp.
0 cites - 0 cites