Patents/Inventors

Zhiguo Qian

Chandler, AZUS28 patents

25 Patents

US125885242026
Stacked via Modulator in High Speed Interconnect
Intel Corporation
0 cites
US125388232026
Power Delivery for Embedded Bridge Die Utilizing Trench Structures
Intel Corporation
0 cites
US124827332025
Ground via Clustering for Crosstalk Mitigation
Intel Corporation
0 cites
US123477882025
Glass Substrates Having Signal Shielding for Use with Semiconductor Packages and Related Methods
Intel Corporation
0 cites
US122666822025
Capacitors and Resistors at Direct Bonding Interfaces in Microelectronic Assemblies
Intel Corporation
0 cites
US122551302025
Airgap Structures for High Speed Signal Integrity
Intel Corporation
0 cites
US121598402024
Scalable and Interoperable PHYLESS Die-to-die IO Solution
Intel Corporation
0 cites
US121257772024
Minimizing Package Impedance Discontinuity Through Dielectric Structure Optimizations
Intel Corporation
0 cites
US121070602024
Microelectronic Assemblies with Inductors in Direct Bonding Regions
Intel Corproation
0 cites
US121006622024
Power-forwarding Bridge for Inter-chip Data Signal Transfer
Intel Corporation
0 cites
US120626162024
Power Delivery for Embedded Bridge Die Utilizing Trench Structures
Intel Corporation
0 cites
US120339302024
Selectively Roughened Copper Architectures for Low Insertion Loss Conductive Features
Intel Corporation
0 cites
US120093202024
Interconnect Loss of High Density Package with Magnetic Material
Intel Corporation
0 cites
US119844392024
Microelectronic Assemblies
Intel Corporation
0 cites
US119233082024
Die Interconnect Structures Having Bump Field and Ground Plane
Intel Corporation
0 cites
US119012802024
Ground via Clustering for Crosstalk Mitigation
Intel Corporation
0 cites
US118879322024
Dielectric-filled Trench Isolation of Vias
Intel Corporation
0 cites
US118375492023
Power Delivery for Embedded Bridge Die Utilizing Trench Structures
Intel Corporation
0 cites
US118173912023
Power Delivery for Embedded Bridge Die Utilizing Trench Structures
Intel Corporation
0 cites
US117422752023
Ground via Clustering for Crosstalk Mitigation
Intel Corporation
0 cites
US116949522023
Horizontal Pitch Translation Using Embedded Bridge Dies
Intel Corporation
0 cites
US116826132023
Package Substrates with Magnetic Build-up Layers
Intel Corporation
0 cites
US116212272023
Power Delivery for Embedded Bridge Die Utilizing Trench Structures
Intel Corporation
0 cites
US115748622023
Optimal Signal Routing Performance Through Dielectric Material Configuration Designs in Package Substrate
Intel Corporation
0 cites
US115454162023
Minimization of Insertion Loss Variation in Through-silicon Vias (tsvs)
Intel Corporation
0 cites