Zhicheng Ding

6 Patents

• US120274962024

  Film in Substrate for Releasing Z Stack-up Constraint

  Intel Corporation

  0 cites
• US119903952024

  Joint Connection of Corner Non-critical to Function (NCTF) Ball for BGA Solder Joint Reliability (SJR) Enhancement

  Intel Corporation

  0 cites
• US118943442024

  Power Enhanced Stacked Chip Scale Package Solution with Integrated Die Attach Film

  Intel Corporation

  0 cites
• US118482812023

  Die Stack with Reduced Warpage

  Intel Corporation

  0 cites
• US118308482023

  Electronic Device Package

  Intel Corporation

  0 cites
• US117422842023

  Interconnect Structure Fabricated Using Lithographic and Deposition Processes

  Intel Corporation

  0 cites