Patents/Inventors

Zhenyu Shi

JinanCN14 patents

15 Patents

US124865572025
Ceramic Tool with Integrated Temperature Sensing and Cutting Functions, Preparation Method and Application Thereof
SHANDONG UNIVERSITY
0 cites
US124544892025
Alumina-based Ceramic Tool Material with Low Thermal Expansion and Preparation Process Thereof
YANSHAN UNIVERSITY
0 cites
US124339722025
Hydrogel for Cell-laden Bioprinting, Bioink, and Preparation Method and Application Thereof
YANSHAN UNIVERSITY
0 cites
US123840732025
Method for Preparing Shell-bionic Ceramic Tool and Shell-bionic Ceramic Tool
YANSHAN UNIVERSITY
0 cites
US122443892025
Positioning Beam Information Obtaining Method and Apparatus
HUAWEI TECHNOLOGIES CO., Ltd.
0 cites
US122213842025
Crack Self-healing Functionally Gradient Material for Ceramic Cutting Tools and Preparation Method Thereof
YANSHAN UNIVERSITY
0 cites
US121458892024
Carbon Nitride Based Composite Ceramic Tool Materials, Preparation Method and Cutting Tool Thereof
YANSHAN UNIVERSITY
0 cites
US120747432024
Reference Signal Generation Method, Reference Signal Detection Method, and Communications Apparatus
HUAWEI TECHNOLOGIES CO., Ltd.
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US120041052024
Time Synchronization Method and Apparatus
HUAWEI TECHNOLOGIES CO., Ltd.
0 cites
US119976382024
Positioning Method and Device
HUAWEI TECHNOLOGIES CO., Ltd.
0 cites
US119714972024
Positioning Reference Signal Sending Method and Related Apparatus
HUAWEI TECHNOLOGIES CO., Ltd.
0 cites
US119475382024
Query Processing
International Business Machines Corporation
0 cites
US117356832023
Single-crystal Beta-ga 2 O 3 MSM Detector and Preparation Method Thereof
YANSHAN UNIVERSITY
0 cites
US116377292023
Reference Signal Generation Method, Reference Signal Detection Method, and Communications Apparatus
HUAWEI TECHNOLOGIES CO., Ltd.
0 cites
US115885382023
Positioning Beam Information Obtaining Method and Apparatus
HUAWEI TECHNOLOGIES CO., Ltd.
0 cites