Zhaozhi Li

4 Patents

• US126047332026

  Package Structures with Collapse Control Features

  Intel Corporation

  0 cites
• US126047542026

  Package Structures with Non-uniform Interconnect Features

  Intel Corporation

  0 cites
• US125989892026

  Package Structures with Patterned Die Backside Layer

  Intel Corporation

  0 cites
• US115520352023

  Electronic Package with Stud Bump Electrical Connections

  Intel Corporation

  0 cites