4 Patents
- US125507732026Chip Embedded Composite for Electron Beam Lithography, Preparation Method and Application Thereof
THE CHINESE UNIVERSITY OF HONGKONG, SHENZHEN
0 cites - 0 cites
- US118413422023Shear-type Vibration-ultrasonic Composite Sensor and Measuring Device
XI'AN JIAOTONG UNIVERSITY
0 cites - US115814892023White Light Emitting Material, Preparation Method Thereof, and Application Thereof
South University Of Science And Technology Of China
0 cites