5 Patents
- US122437732025Liner and Barrier Layer in Dual Damascene Cu Interconnect for Enhanced EM and Process
Sien (Qingdao) Integrated Circuits Co., Ltd.
0 cites - US121319462024Method to Form Contacts with Multiple Depth by Enhanced CESL
Sien (Qingdao) Integrated Circuits Co., Ltd.
0 cites - US119787022024Simultaneous Self-forming Hea Barrier and Cu Seeding Layers for Cu Interconnect
Sien (Qingdao) Integrated Circuits Co., Ltd.
0 cites - US118606502024Method for Monitoring and Controlling Supporting Posture of Supporting-type Hydraulic Support
SHANDONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
0 cites - US118347542023ALD Method with Multi-chambers for Sic or Multi-elements Epitaxial Growth
Sien (Qingdao) Integrated Circuits Co., Ltd.
0 cites