6 Patents
- 0 cites
- US120210602024Reducing Keep-out-zone Area for a Semiconductor Device
Western Digital Technologies, Inc.
0 cites - US120210612024Packaged Memory Device with Flip Chip and Wire Bond Dies
Western Digital Technologies, Inc.
0 cites - 0 cites
- US118108962023Substrate Component Layout and Bonding Method for Increased Package Capacity
Western Digital Technologies, Inc.
0 cites - US117841352023Semiconductor Device Including Conductive Bumps to Improve EMI/RFI Shielding
Western Digital Technologies, Inc.
0 cites