6 Patents
- US126160082026Inverting Wafer and Etching Back Plane to Expose Conductive Pillars from Back Plane of Wafer for Further Processing
CHANGXIN MEMORY TECHNOLOGIES, Inc.
0 cites - US124179952025Chip Packaging Structure and Method for Preparing the Same, and Method for Packaging Semiconductor Structure
CHANGXIN MEMORU TECHNOLOGIES, Inc.
0 cites - US121912712025Semiconductor Structure Comprising Up-narrow and Down-wide Openings and Forming Method Thereof
CHANGXIN MEMORY TECHNOLOGIES, Inc.
0 cites - US121763112024Micro Bump, Method for Forming Micro Bump, Chip Interconnection Structure and Chip Interconnection Method
CHANGXIN MEMORY TECHNOLOGIES, Inc.
0 cites - US121320222024Semiconductor Devices and Preparation Methods Thereof
CHANGXIN MEMORY TECHNOLOGIES, Inc.
0 cites - US119786982024Method for Forming a Semiconductor Package Structure
CHANGXIN MEMORY TECHNOLOGIES, Inc.
0 cites