Patents/Inventors

Zengbiao Huang

DongguanCN4 patents

5 Patents

US123783862025
Resin Composition and Application Thereof
SHENGYI TECHNOLOGY CO., Ltd.
0 cites
US121229042024
Thermosetting Resin Composition and Prepreg, Laminate and Printed Circuit Board Using Same
SHENGYI TECHNOLOGY CO., Ltd.
0 cites
US117321232023
Thermosetting Resin Composition, and Prepreg, Laminate and Printed Circuit Board Using Same
SHENGYI TECHNOLOGY CO., Ltd.
0 cites
US116613782023
Boron Nitride Agglomerate, Thermosetting Resin Composition Containing Same, and Use Thereof
Shengyi Technology Co., Ltd.
0 cites
US116493512023
Resin Composition for a Metal Substrate, and Resin Varnish and Metal Base Copper-clad Laminate Comprising the Same
Shengyi Technology Co., Ltd.
0 cites