Zavier Zai Yeong Tan

2 Patents

• US119012322024

  Automatic Kerf Offset Mapping and Correction System for Laser Dicing

  Applied Materials, Inc.

  0 cites
• US118548882023

  Laser Scribing Trench Opening Control in Wafer Dicing Using Hybrid Laser Scribing and Plasma Etch Approach

  Applied Materials, Inc.

  0 cites