Patents/Inventors

Zachary M Tedoff

Hayward, CAUS4 patents

3 Patents

US125507802026
Die Reconstitution and High-density Interconnects for Embedded Chips
Neuralink Corp.
0 cites
US125390832026
Electrode Fabrication and Design
Neuralink Corp.
0 cites
US123910322025
Dicing and Partial Dicing Release of Lithographed Device
Neuralink Corp.
0 cites