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Yuuta Terao
Okazaki
JP
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1 Patent
US12152113
2024
Filler-loaded High Thermal Conductive Dispersion Liquid Composition Having Excellent Segregation Stability, Method for Producing Said Dispersion Liquid Composition, Filler-loaded High Thermal Conductive Material Using Said Dispersion Liquid Composition, Method for Producing Said Material, and Molded Article Obtained Using Said Material
TAKAGI CHEMICALS, Inc.
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