6 Patents
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- US124419382025Semiconductor Nanoparticles Composed of Agaus-based Multicomponent Compound
TANAKA KIKINZOKU KOGYO K.K.
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- US120354702024Electroconductive Substrate Having Metal Wiring, Method for Producing the Electroconductive Substrate, and Metal Ink for Forming Metal Wiring
TANAKA KIKINZOKU KOGYO K.K.
0 cites - US119674412024Metal Wiring and Conductive Sheet Both Excellent in Bending Resistance, and Metal Paste for Forming the Metal Wiring
TANAKA KIKINZOKU KOGYO K.K.
0 cites - 0 cites