Yuuki Iijima

8 Patents

• US125764632026

  Lead-free and Antimony-free Solder Alloy, Solder Ball, and Solder Joint

  Senju Metal Industry Co., Ltd.

  0 cites
• US125699412026

  Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, In-vehicle Electronic Circuit, ECU Electronic Circuit, In-vehicle Electronic Circuit Device and ECU Electronic Circuit Device

  Senju Metal Industry Co., Ltd.

  0 cites
• US124475642025

  Solder Alloy, Solder Ball, and Solder Joint

  Senju Metal Industry Co., Ltd.

  0 cites
• US123839872025

  Lead-free and Antimony-free Solder Alloy, Solder Ball, Ball Grid Array, and Solder Joint

  Senju Metal Industry Co., Ltd.

  0 cites
• US123775002025

  Lead-free and Antimony-free Solder Alloy, Solder Ball, and Solder Joint

  Senju Metal Industry Co., Ltd.

  0 cites
• US120538432024

  Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, In-vehicle Electronic Circuit, ECU Electronic Circuit, In-vehicle Electronic Circuit Device and ECU Electronic Circuit Device

  Senju Metal Industry Co., Ltd.

  0 cites
• US116077532023

  Solder Alloy, Cast Article, Formed Article, and Solder Joint

  SENJU METAL INDUSTRY CO., Ltd.

  0 cites
• US115773442023

  Solder Alloy

  SENJU METAL INDUSTRY CO., Ltd.

  0 cites