Yutaro Aoki

6 Patents

• US124733092025

  Organometallic Compound and Method of Manufacturing Integrated Circuit Using the Same

  ADEKA CORPORATION

  0 cites
• US124102032025

  Organometallic Adduct Compound and Method of Manufacturing Integrated Circuit Using the Same

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US122915412025

  Compound, Thin-film Forming Raw Material, and Method of Producing Thin-film

  ADEKA CORPORATION

  0 cites
• US120923802024

  Power Element and Expansion Valve Using Same

  Fujikoki Corporation

  0 cites
• US120610252024

  Power Element and Expansion Valve Using Same

  FUJIKOKI CORPORATION

  0 cites
• US118076522023

  Tungsten Compound, Raw Material for Thin Film Formation and Method for Producing Thin Film

  ADEKA CORPORATION

  0 cites