Patents/Inventors

Yusheng Lin

Phoenix, AZUS40 patents

35 Patents

USD11215772026
Power Package
Wolfspeed, Inc.
0 cites
US125562762026
Lighting Apparatus
LEEDARSON LIGHTING CO., Ltd.
0 cites
US125435792026
Dual Side Cooled Power Module with Three-dimensional Direct Bonded Metal Substrates
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124697092025
Semiconductor Package Electrical Contact Structures and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124631232025
Multi-chip System-in-package
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124291762025
Lighting Apparatus
LEEDARSON LIGHTING CO., Ltd.
0 cites
US124313592025
Semiconductor Package Electrical Contacts and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124142382025
Substrate Structures and Methods of Manufacture
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US123745552025
Die Sidewall Coatings and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US123622662025
Low Stress Asymmetric Dual Side Module
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US123550092025
Low Stress Asymmetric Dual Side Module
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US123477552025
Low Stress Asymmetric Dual Side Module
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US123478122025
Low Stress Asymmetric Dual Side Module
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122939552025
High Power Module Package Structures
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122610842025
Fan-out Wafer Level Packaging of Semiconductor Devices
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122305022025
Semiconductor Package Stress Balance Structures and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122117752025
Multiple Substrate Package Systems and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US121990412025
Thinned Semiconductor Package and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US121837852024
Monolithic Semiconductor Device Assemblies
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US120625492024
Semiconductor Packages and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US120401922024
Die Sidewall Coatings and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US120402952024
Semiconductor Device with Backmetal and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119554122024
Low Stress Asymmetric Dual Side Module
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119488702024
Low Stress Asymmetric Dual Side Module
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119358172024
Power Device Module with Dummy Pad Die Layout
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119088402024
Low Stress Asymmetric Dual Side Module
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US118943472024
Low Stress Asymmetric Dual Side Module
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US118107752023
High Power Module Package Structures
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US117912882023
Reinforced Semiconductor Die and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US117423812023
Monolithic Semiconductor Device Assemblies
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US117284242023
Isolation in a Semiconductor Device
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US116462672023
Thinned Semiconductor Package and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US115945102023
Assembly Processes for Semiconductor Device Assemblies Including Spacer with Embedded Semiconductor Die
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US115691402023
Semiconductor Package with Elastic Coupler and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US115629382023
Spacer with Pattern Layout for Dual Side Cooling Power Module
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites