Yunzhi Ling

4 Patents

• US125062522025

  Fan-out Package Structure and Fabrication Method Therefor

  Institute Of Semiconductors, Guangdong Academy Of Sciences

  0 cites
• US122666232025

  Substrate Bonding Method

  Shenzhen Xiuyuan Electronic Technology Co., Ltd.

  0 cites
• US121129562024

  Chip Interconnection Package Structure and Method

  Institute Of Semiconductors, Guangdong Academy Of Sciences

  0 cites
• US118698722024

  Chip Stack Packaging Structure and Chip Stack Packaging Method

  Institute Of Semiconductors, Guangdong Academy Of Sciences

  0 cites