7 Patents
- US124245852025Apparatus for Bonding Chip Band and Method for Bonding Chip Using the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US123664442025Optical Assembly for Parallelism Measurement, Optical Apparatus Including the Same, Die Bonding System and Die Bonding Method Using the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US122239172025Display Driving Integrated Circuit Configured to Perform Adaptive Frame Operation and Operation Method Thereof
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US119484842024Electronic Device and Method for Predicting and Compensating for Burn-in of Display
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US118105192023Display Driving Integrated Circuit Configured to Perform Adaptive Frame Operation and Operation Method Thereof
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- US116313822023Electronic Device for Controlling Display Position or Area of Image on Basis of Change of Content of Image
SAMSUNG ELECTRONICS CO., Ltd.
0 cites