5 Patents
- US124514002025Semiconductor Package Having Improved Heat Dissipation Characteristics
Samsung Electronics Co., Ltd.
0 cites - US123946872025Semiconductor Package Including a Heat Dissipation Structure
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US121237892024Method and Device for Temperature Detection and Thermal Management Based on Power Measurement
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US119087742024Semiconductor Package Including Composite Molding Structure
Samsung Electronics Co., Ltd.
0 cites - 0 cites