Yung-shun Chang

5 Patents

• US125576302026

  Package Structure with Interposer Encapsulated by an Encapsulant

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US123006022025

  Semiconductor Package Structure and Method for Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US121762592024

  Semiconductor Package Structure

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US118879282024

  Package Structure with Interposer Encapsulated by an Encapsulant

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US116212202023

  Assembly Structure and Method for Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites