Yung-lung Lin

11 Patents

• US123603142025

  Photonic Semiconductor-on-insulator (SOI) Substrate and Method for Forming the Photonic SOI Substrate

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US123158432025

  Hybrid Bonding Technology for Stacking Integrated Circuits

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US123006702025

  Hybrid Bond Pad Structure

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US122939462025

  Techniques for Wafer Stack Processing

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US122371652025

  Method for Wafer Bonding Including Edge Trimming

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites
• US119844312024

  3DIC Structure and Methods of Forming

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US119515692024

  Damage Prevention During Wafer Edge Trimming

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US118429922023

  Seal Ring Structures and Methods of Forming Same

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US118044732023

  Hybrid Bond Pad Structure

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US115879082023

  3DIC Structure and Methods of Forming

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US115453952023

  Techniques for Wafer Stack Processing

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites