3 Patents
- US126222862026Side-wettable Semiconductor Package Device with Heat Dissipation Surface Structure
PANJIT INTERNATIONAL Inc.
0 cites - US122242282025Packaged Component with Composite Pin Structure and Manufacturing Method Thereof
PANJIT INTERNATIONAL Inc.
0 cites - US117746732023Optical Communication Package Structure and Method for Manufacturing the Same
ADVANCED SEMICONDUCTOR ENGINEERING, Inc.
0 cites