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Inventors
Yung-ching Chao
Gukeng Township
TW
1 patent
2 Patents
US12230595
2025
Metal Bumps and Method Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US12136644
2024
Process for Tuning via Profile in Dielectric Material
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites