Patents/Inventors

Yung-chi Chu

KaohsiungTW15 patents

19 Patents

US124944052025
Fabricating a Sensing Component Encapsulated by an Encapsulation Layer with Roughed Surface Having a Hollow Region
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124128672025
Integrated Fan-out Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123157722025
Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122835452025
Package Structure and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122118022025
Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122118152025
Micro LED Display Panel
PLAYNITRIDE DISPLAY CO., Ltd.
0 cites
US122059032025
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121426012024
Micro Light-emitting Diode Package Structure and Micro Light-emitting Diode Display Apparatus
Playnitride Display Co., Ltd.
0 cites
US120876542024
Sensing Die Encapsulated by an Encapsulant with a Roughness Surface Having a Hollow Region
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119424172024
Sensor Package and Method
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US118943362024
Integrated Fan-out Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118694182024
Micro Light Emitting Diode Display Panel
Playnitride Display Co., Ltd.
0 cites
US118625602024
Package Structure and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118626142024
Micro LED Display Device and Manufacturing Method Thereof
Playnitride Display Co., Ltd.
0 cites
US118549972023
Method of Forming Semiconductor Device
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US117988572023
Composition for Sacrificial Film, Package, Manufacturing Method of Package
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117988932023
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117641242023
Sensing Component Encapsulated by an Encapsulant with a Roughness Surface Having a Hollow Region
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116949672023
Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites