Patents/Inventors

Yung-cheng Lee

Boulder, COUS10 patents

10 Patents

US126074132026
Polymer-based Microfabricated Thermal Ground Plane
KELVIN THERMAL TECHNOLOGIES, Inc.
0 cites
US124807162025
Thermal Management Planes
Kelvin Thermal Technologies, Inc.
0 cites
US124646792025
Folding Thermal Ground Plane
Kelvin Thermal Technologies, Inc.
0 cites
US123856972025
Micropillar-enabled Thermal Ground Plane
Kelvin Thermal Technologies, Inc.
0 cites
US121887322025
Single and Multi-layer Mesh Structures for Enhanced Thermal Transport
The Regents Of The University Of Colorado
0 cites
US121048562024
Method and Device for Optimization of Vapor Transport in a Thermal Ground Plane Using Void Space in Mobile Systems
THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE
0 cites
US119884532024
Thermal Management Planes
KELVIN THERMAL TECHNOLOGIES, Inc.
0 cites
US119306212024
Folding Thermal Ground Plane
Kelvin Thermal Technologies, Inc.
0 cites
US118988072024
Single and Multi-layer Mesh Structures for Enhanced Thermal Transport
The Regents Of The University Of Colorado, A Body Corporate
0 cites
US115985942023
Micropillar-enabled Thermal Ground Plane
THE REGENTS OF THE UNIVERSITY OF COLORADO
0 cites