Yun Hwan Kim

3 Patents

• US124530122025

  Printed Circuit Board and Method of Manufacturing the Same

  SAMSUNG ELECTRO-MECHANICS CO., Ltd.

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• US121069422024

  Plasma Processing Apparatus and Method for Dechucking Wafer in the Plasma Processing Apparatus

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US116187102023

  Nano Protrusion Surface Forming Method and Base Material Having Nano Protrusion Surface Formed by Method

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