Yun-hsing Sung

3 Patents

• US125572132026

  Micro-roughened Electrodeposited Copper Foil and Copper Clad Laminate

  CO-TECH DEVELOPMENT Corp.

  0 cites
• US121208162024

  Micro-roughened Electrodeposited Copper Foil and Copper Clad Laminate

  CO-TECH DEVELOPMENT Corp.

  0 cites
• US116555552023

  Advanced Reverse Treated Electrodeposited Copper Foil and Copper Clad Laminate Using the Same

  CO-TECH DEVELOPMENT Corp.

  0 cites