Patents/Inventors

Yun Chen Teng

New TaipeiTW12 patents

12 Patents

US125576122026
Bonding System with Sealing Gasket and Method for Using the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123476962025
Laser De-bonding Carriers and Composite Carriers Thereof
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123278112025
Ion Implantation with Annealing for Substrate Cutting
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US122836222025
Semiconductor Device and Method
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122665742025
Flowable Chemical Vapor Deposition (FCVD) Using Multi-step Anneal Treatment and Devices Thereof
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US122551712025
Wafer Bonding System and Method of Using the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US122495922025
Dynamic Bonding Gap Control and Tool for Wafer Bonding
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US122372112025
Bonding System with Sealing Gasket and Method for Using the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US122305322025
Semiconductor Device, Method of Manufacture by Monitoring Relative Humidity, and System of Manufacture Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US119087082024
Laser De-bonding Carriers and Composite Carriers Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US118550402023
Ion Implantation with Annealing for Substrate Cutting
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US117284062023
Semiconductor Device and Method
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites