5 Patents
- US125936392026Method for Processing Substrate, Chemical Solution, and Method for Providing Chemical Solution
TOKYO OHKA KOGYO CO., Ltd.
0 cites - US121879432025Chemical Solution Used for Cleaning or Etching Ruthenium-containing Layer and Method for Fabricating Ruthenium Wiring
TOKYO OHKA KOGYO CO., Ltd.
0 cites - US121042602024Method for Producing Semiconductor Element and Chemical Solution to Be Used in Method for Producing Semiconductor Element
TOKYO OHKA KOGYO CO., Ltd.
0 cites - US118980812024Ruthenium-etching Solution, Method for Manufacturing Ruthenium-etching Solution, Method for Processing Object to Be Processed, and Method for Manufacturing Ruthenium-containing Wiring
TOKYO OHKA KOGYO CO., Ltd.
0 cites - 0 cites