11 Patents
- US125815932026Prepreg, and Metal-clad Laminated Board and Wiring Substrate Obtained Using Same
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites - US124285342025Resin Composition, Prepreg, Film with Resin, Metal Foil with Resin, Metal-clad Laminated Board, and Wiring Board
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites - US123124522025Resin Composition, Prepreg, Film with Resin, Metal Foil with Resin, Metal-clad Laminate, and Wiring Board
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites - US122336212025Copper-clad Laminated Plate, Resin-clad Copper Foil, and Circuit Substrate Using Said Plate and Foil
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites - US121097792024Copper-clad Laminate, Wiring Board, and Copper Foil with Resin
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites - US120245902024Resin Composition, Prepreg, Film with Resin, Metal Foil with Resin, Metal-clad Laminate, and Wiring Board
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites - US120226112024Prepreg, Metal-clad Laminate, and Wiring Board
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites - US119589512024Resin Composition, Prepreg, Resin-equipped Film, Resin-equipped Metal Foil, Metal-cladded Layered Sheet, and Wiring Board
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites - US118665362024Copper-clad Laminate Plate, Resin-attached Copper Foil, and Circuit Board Using Same
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites - US118201052023Prepreg, Metal-clad Laminate, and Wiring Board
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites - US117709042023Surface-treated Copper Foil, and Copper-clad Laminate Plate, Resin-attached Copper Foil and Circuit Board Each Using Same
FUKUDA METAL FOIL & POWDER CO., Ltd.
0 cites