Patents/Inventors

Yuki Antoku

SagaJP2 patents

3 Patents

US122372932025
Palladium-coated Copper Bonding Wire, Manufacturing Method of Palladium-coated Copper Bonding Wire, Wire Bonding Structure Using the Same, Semiconductor Device and Manufacturing Method Thereof
TANAKA DENSHI KOGYO K. K.
0 cites
US120877242024
Palladium-coated Copper Bonding Wire and Method for Manufacturing Same
TANAKA DENSHI KOGYO K. K.
0 cites
US118760662024
Palladium-coated Copper Bonding Wire, Wire Bonding Structure, Semiconductor Device, and Manufacturing Method of Semiconductor Device
TANAKA DENSHI KOGYO K.K.
0 cites