Yujuan Tao

2 Patents

• US125640832026

  Packaging Structure Having Semiconductor Chips and Encapsulation Layers and Formation Method Thereof

  TONGFU MICROELECTRONICS CO., Ltd.

  0 cites
• US124380982025

  Packaging Structure and Fabrication Method Thereof

  TONGFU MICROELECTRONICS CO., Ltd.

  0 cites