5 Patents
- US125819842026Apparatus and Methods for Bonding Pad Redistribution Layers in Integrated Circuits
Sandisk Technologies, Inc.
0 cites - US124083452025Three-dimensional Memory Device with Backside Support Pillar Structures and Methods of Forming the Same
Sandisk Technologies, Inc.
0 cites - US119439222024Non-volatile Memory with Three Dimensional Stacked Word Line Switches
Western Digital Technologies, Inc.
0 cites - US118442222023Three-dimensional Memory Device with Backside Support Pillar Structures and Methods of Forming the Same
SANDISK TECHNOLOGIES LLC
0 cites - US116370382023Three-dimensional Memory Device Containing Self-aligned Lateral Contact Elements and Methods for Forming the Same
SANDISK TECHNOLOGIES LLC
0 cites