Patents/Inventors

Yuji Mimura

KoshiJP14 patents

9 Patents

US126223362026
Bonding Layer and Process
Tokyo Electron Limited
0 cites
US125820172026
Bonding Layer and Process
Tokyo Electron Limited
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US124808842025
Analysis Apparatus, Bonding System, and Analysis Method
TOKYO ELECTRON LIMITED
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US124696852025
Surface Modifying Apparatus and Bonding Strength Determination Method
TOKYO ELECTRON LIMITED
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US124513742025
Bonding System and Inspection Method of Inspecting Combined Substrate
TOKYO ELECTRON LIMITED
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US123947492025
Bonding System and Surface Modification Method
TOKYO ELECTRON LIMITED
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US121572932024
Separating Method, Separating Apparatus, and Separating System
TOKYO ELECTRON LIMITED
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US117911822023
Measuring Method and Measuring Device
TOKYO ELECTRON LIMITED
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US116263022023
Bonding Method for Cleaning Non-bonding Surface of Substrate
TOKYO ELECTRON LIMITED
0 cites