Patents/Inventors

Yuhong Cai

Folsom, CAUS8 patents

8 Patents

US122665912025
Choked Flow Cooling
SK Hynix NAND Product Solutions Corp.
0 cites
US120682832024
Die Stack with Cascade and Vertical Connections
Intel Corporation
0 cites
US119489172024
Die Over Mold Stacked Semiconductor Package
Intel Corporation
0 cites
US119012642024
Choked Flow Cooling
SK Hynix NAND Product Solutions Corp.
0 cites
US118943342024
Dual Head Capillary Design for Vertical Wire Bond
Intel Corporation
0 cites
US118482922023
Pad Design for Thermal Fatigue Resistance and Interconnect Joint Reliability
Intel Corporation
0 cites
US116949762023
Bowl Shaped Pad
Intel Corporation
0 cites
US115691442023
Semiconductor Package Design for Solder Joint Reliability
Intel Corporation
0 cites