Yu-yuan Yeh

3 Patents

• US120503502024

  Semiconductor Package Structure and Method of Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US117914342023

  Electronic Package, Optoelectronic Package and Method of Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US116045522023

  Metal Mesh Structure

  HENGHAO TECHNOLOGY CO., Ltd.

  0 cites